Accelerating the journey from silicon to mission-ready hardware with advanced packaging, testing, and qualification.
Our tested and qualified silicon has helped enable some of the world’s most challenging missions, from secure military communications to deep-space exploration, including missions to Saturn.
Silicon we tested and qualified has flown on some of the most demanding missions ever launched — from protected military communications to the rings of Saturn.
Hardened components for the protected military SATCOM constellation
Qualified electronics that survived 20 years en route to Saturn
Screened silicon aboard Advanced EHF secure communications satellites
Test & qualification for Ka-band broadband spacecraft payloads
iTest Hi-Rel brings together independent high reliability engineering IP and the enterprise-scale test infrastructure of iTest Inc. to deliver the complete semiconductor deployment sequence. One accountable engineering partner. Zero shortcuts.
We leverage what has been proven in the commercial marketplace AI, advanced networking, high-performance computing and apply that engineering intelligence to industrial hardening, militarization, ruggedization, and the final transition to space and defense deployment.
From silicon to mission-ready, we deliver power, thermal, test, packaging, and qualification engineering solutions built for the harshest operating environments.
Semiconductor design organizations create the advanced silicon that powers next-generation defense and space systems. iTest Hi-Rel in affiliation with iTest Inc. provides the specialized engineering capability to take those technologies from first silicon to mission deployment. The combination of iTest Hi-Rel’s independent Hi-Rel IP and iTest Inc.’s proven commercial-scale test infrastructure gives customers a uniquely powerful path from commercial innovation to mission-ready hardware.
Advanced semiconductor characterization for high-performance devices from ultra-high pin count and high-speed interfaces through RF and millimeter-wave coverage, high-power evaluation, and wafer sort / probe.
Our specialty is developing custom qualification plans tailored to specific applications and markets, enabling faster time-to-market through optimized stress conditions, reduced sample sizes where appropriate, and engineering-driven reliability analysis.
Burn-in treated as a reliability intelligence process combining high-speed and high-power stress with thermal control, real-time monitoring, and diagnostics to surface early failures before deployment.
Dedicated hardware design and signal integrity engineering for complex ATE and mission interfaces RF and high-speed connectivity, power and thermal engineering, and intelligent hardware systems.
Comprehensive RF characterization and millimeter-wave device validation supporting radar, electronic warfare, and satellite communications semiconductor technologies.
Purpose-built for today’s most complex package technologies, supporting ultra-high pin-count devices and advanced package formats, including MLO and large-format packages up to 120 mm × 120 mm. Engineered for high-performance electrical validation where conventional test solutions reach their limits.
300 mm wafer sort capability with advanced thermal control for at-speed characterization, engineering development, debug, and high-volume production testing. Utilizing leading-edge TEL probers with precision probe card alignment and automated self-inspection, we deliver maximum test accuracy, repeatability, and throughput.
Specialized test infrastructure for high-power semiconductor devices including GaN, SiC, and high-voltage transistors used in power conversion and RF amplification applications.
Traditional latch-up methodologies were not designed for today’s high-pin-count, multi-domain semiconductor devices. iTest utilizes production-class ATE platforms to perform mission-mode latch-up characterization, automated parametric analysis, and high-current stress testing under realistic operating conditions, providing greater accuracy, observability, and confidence for qualification of advanced semiconductor technologies.
Dedicated hardware design and signal integrity engineering for complex ATE and mission interfaces RF and high-speed connectivity, power and thermal engineering, and intelligent hardware systems.
Advanced in-situ, real-time monitoring during environmental and electrical stress testing enables continuous device characterization throughout the stress cycle. By tracking performance drift, process variation, and distribution trends, we identify early reliability indicators and failure mechanisms before they become field failures accelerating qualification while increasing confidence in long-term product reliability.
End-to-end program logistics and lifecycle management supporting semiconductor qualification from initial engineering evaluation through production and sustained program support.
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